Figure 4-7. BH1766 circuit board assembly (sheet 2 of 2).
Provide a heat sink on leads
Provide a heat sink on
leads between terminal
between terminal and case
ing to prevent damage to di-
ing to prevent damage to
(10) Replace zener diodes and recti-
(11) Replace any circuit board resist-
fiers if testing proves them defective.
ors not within tolerance.